Microelectronic Packaging Materials- Materion Microelectronics and Services

By: Williams Advanced Materials  05/12/2011

Microelectronic Packaging Materials

  • Gold bonding wire
  • Near Hermetic cover lids including Combo Lids®
  • Gold and silver bonding ribbon
  • Solder preforms

Our product offering also includes ceramic air cavity and BeO packages, CuPacks™, plated flanges, ceramic substrates (direct bond copper and metallized ceramic).

At Materion Microelectronics & Services, we are leaders in providing engineered solutions for ceramic packages and hermetic cover/lids.  Our tooling libraries for solder preforms and ceramic packages are extensive, and our state-of-the-art manufacturing sites around the world offer industry-leading lead times and unsurpassed customer service.  Our products are produced in the USA, Singapore and the Philippines depending upon the configuration, application and volume requirements.

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