Microelectronic Packaging Materials
- Gold bonding wire
- Near Hermetic cover lids including Combo Lids®
- Gold and silver bonding ribbon
- Solder preforms
Our product offering also includes ceramic air cavity and BeO packages, CuPacks™, plated flanges, ceramic substrates (direct bond copper and metallized ceramic).
At Materion Microelectronics & Services, we are leaders in providing engineered solutions for ceramic packages and hermetic cover/lids. Our tooling libraries for solder preforms and ceramic packages are extensive, and our state-of-the-art manufacturing sites around the world offer industry-leading lead times and unsurpassed customer service. Our products are produced in the USA, Singapore and the Philippines depending upon the configuration, application and volume requirements.