8 Layers High-density PCB for Telecom with 1.0±0.1mm Board Thickness

By: Agile Circuit Co., Ltd  11/08/2009
Keywords: Electronic Parts, Electronic Parts And Equipment, printed circuit boards

   8 Layers High-density PCB for Telecom with 1.0±0.1mm Board Thickness Layers: 8 Surface finish: ENIG+OSP Board thickness: 1.0±0.1mm Dimensions: 7.698 x 4.661mm Min drill diameter: 0.3mm Aspect ratio: 3.3:1 Line/space: 3mil/3mil Material: FR4 150 Function: telecom

Keywords: Circuit Board, Electronic Parts, Electronic Parts And Equipment, printed circuit boards

Contact Agile Circuit Co., Ltd

Email

Print this page

Share